Layer thickness determination
Facilities for non-destructive and destructive coating thickness determinations are available:
Non-destructive layer thickness measurement
- of Cu layers on printed circuit boards
- of plastics and anodised layers on non-magnetic base material
- of electroplated layers and lacquer layers on ferrous materials
Measurement methods
- magnetic inductive (DIN EN ISO 2178)
- magnetic (DIN EN ISO 2178) with eddy current (DIN EN ISO 2360)
- electrical resistance (4 peaks)
- X-ray fluorescence (in individual cases)
Destructive layer thickness measurement
After suitable preparation of the sample, it is viewed under the light or scanning electron microscope. In both cases, PC-supported image analysis is used for evaluation.
Dr.-Ing. Kerstin Kern
IMP Institut für Mikrotechnik und Photonik Projektleiterin und Fachverantwortliche Werkstoffprüfung
+41 58 257 34 08 kerstin.kern@ost.ch
