Packaging technologies
Wafer-Level
- Waferlevel Bonder EVG 510
- Wafer dicer Accretech SS30
- Vacuum solder oven VLO 850
Die-Level
- Die bonder Tresky T-3000-FC3
- Wire bonder Delvotec 5630
- Dispenser EFD 1500
- Vacuum solder oven VLO 850
- Various high temperature ovens